Product Development Manager

• beginner on speaking,
• fluent in English,
• Good in Chinese listening/speaking ( Mandarin ),
• Loas,
• writing and listening Japanese

Burapha University,Thailand. B.Sc(Chemistry), 1987-1990

• Reward : scholarship in Science in primary school and secondary school

August15-Present  Rianthai Interplas .co.,ltd( Thai )
Product Development Manager

1. Plastic packaging new product development
2. Process improvement
3. Innovation product introduction

October 2010-February 2011  Normerica Inc. ( CANADIAN )
Factory Manager, 2 plants management

1. Pet’s Food in Wangnoi plantand Rojana  plant in AYUTTHAYA
2. Productivity
3. Processing
4. HACCP/ISO

September 2009-Jul  2010 ILC Ltd. ( THAI )
Sourcing Manager ( Purchasing Department )

1. Raw material sourcing
2. New packaging sourcing
3. Non-cosmetic sourcing
4. SAP

Nov 2003-Dec 2008 SAE Magnetics (HK)Ltd. ( JAPANESE )
Wafer Manufacturing Engineerin/ Design Engineering Manager

1. Photo Process development/ improvement
2. New PMR product implementation and Development
3. KrF/ Nikon Stepper machines capability/ performance improvement
4. Coating/ Developing machine capacity/ performance improvement
5. Line yield improvement
6. New product transfer, TuMR / PMR wafer
7. New product/ process design flow
8. New product/ Process development
9. New process cycle time design flow
10. Advance Process Engineer for Photolithography and dry etching process of the slider fabrication.
11. Implemented new etching recipe to improve the recess uniformity from 7% of 3sigma uniformity to be less than 5% within a quarter.
12. Image reverse process, lamination IR process,  to eliminate the pad DLC fencing issue with the new condition set up.

• Photo wall angle improvement from 5-10 degree to be 15 degree up.
• Productivity improvement on the Stepper machine 15% gain
• Improve the critical dimension sigma on femto with target 0.5um sigma for FH improvement.
• Implement new lamination method and new cleaning technique.

March 1995- September 2003 : Western Digital ( Thailand ) Ltd. ( USA )
Senior Process engineer of Etching/DLC/Photo section of the slider fabrication.

1.   Serialization process : To create the slider serialize number on the back side of the wafer

• Sustain the process yield, productivity, 1% yield improved within 1 quarter, 4% defect reduction within 2 quarters.
• Develop new recipe to simplify process in term of the modify the tooling and equipment, new mask create method implementation.

2.   Metalization process : To coating gold on the back side of the slider for Maxtor product, reduce the resistance on the 80GB

• Sustain the process yield, productivity
• Develop new recipe to simplify process in term of the modify the tooling and equipment

3.    Contamination control engineer, Contamination section ( Reliability )

• Contamination development and improvement to perform over product, machine, process and overall customer failure analysis requirement
• Internal failure analysis to identify root cause from contamination.
• 5S core team for Slider fabrication, HGA and HSA
• Internal data control, temperature, humidity, particle control system
• Implement new glove bin for clean room
• Implement bunny suit control system
• Implement new design of curtain under the laminar
• Photolithography process engineer
• 2 step etch photolithography process, sustaining and development, 98% yield improved achievement, new project transfer.
• Undershoot photolithography process transfer

March 1994- 1995: Lite-On Industrial(Thailand)Ltd. ( TAIWANESE )
Photolithography process engineer ; dry film, wet film and component mark process

• Sustain the process yield, productivity
• Develop new recipe to simplify process in term of the modify the tooling and equipment

March 1991- 1994: P.C.B Center(Thailand) Co.Ltd. ( HONG KONG )
Photolithography Production Superintendent ; dry film, wet film and component mark process

• Sustain the process yield, productivity
• Develop new recipe to simplify process in term of the modify the tooling and equipment

Oversea Training ( USA/China/Singapore/Phillipine/Hongkong ):
The SPIE short course for

• “ Plasma Processing “ on March 1996, California USA.
•  “ Resist Thickness Bake, Exposure and Development control “ on March 1996, California USA.
• “ Introduction to Micro-Lithography :Theory, Material and Processing “on March 1996, California USA.
• “ Introduction to MEMs “ on November 2000, Singapore
• “ Extending Semiconductor Lithography Resolution Using Image Process Integration “ on November, Singapore

Ultratech Stepper training “ 1500/1700 Maintenance course “ on 2-13 December 1996, California USA
Process transfer from California, USA

• “ Full Pallet Debond project “ on February, 1995
• “ New Full Pallet Debond Improvement “ on  June-July 1995
• “ Undershoot product “ on September-October 1995
• “ Proximity pad project “ on 1996
• “ High density Pico process transfer “ on 1996

Technical Seminar for Slider Technology Process Solutions by Veeco at Dong Guan city, Goung Dong, PRC on 16 May’05