Product Development Manager
Summary
Mainly in semiconductor field, technical and management skillmess
Skills
Spoken Languages
- beginner on speaking,
- fluent in English,
- Good in Chinese listening/speaking ( Mandarin ),
- Loas,
- writing and listening Japanese
Education
Burapha University,Thailand. B.Sc(Chemistry), 1987-1990
- Reward : scholarship in Science in primary school and secondary school
Experience
August15-Present Rianthai Interplas .co.,ltd( Thai )
Product Development Manager
- Plastic packaging new product development
- Process improvement
- Innovation product introduction
October 2010-February 2011 Normerica Inc. ( CANADIAN )
Factory Manager, 2 plants management
- Pet’s Food in Wangnoi plantand Rojana plant in AYUTTHAYA
- Productivity
- Processing
- HACCP/ISO
September 2009-Jul 2010 ILC Ltd. ( THAI )
Sourcing Manager ( Purchasing Department )
- Raw material sourcing
- New packaging sourcing
- Non-cosmetic sourcing
- SAP
Nov 2003-Dec 2008 SAE Magnetics (HK)Ltd. ( JAPANESE )
Wafer Manufacturing Engineerin/ Design Engineering Manager
- Photo Process development/ improvement
- New PMR product implementation and Development
- KrF/ Nikon Stepper machines capability/ performance improvement
- Coating/ Developing machine capacity/ performance improvement
- Line yield improvement
- New product transfer, TuMR / PMR wafer
- New product/ process design flow
- New product/ Process development
- New process cycle time design flow
- Advance Process Engineer for Photolithography and dry etching process of the slider fabrication.
- Implemented new etching recipe to improve the recess uniformity from 7% of 3sigma uniformity to be less than 5% within a quarter.
- Image reverse process, lamination IR process, to eliminate the pad DLC fencing issue with the new condition set up.
- Photo wall angle improvement from 5-10 degree to be 15 degree up.
- Productivity improvement on the Stepper machine 15% gain
- Improve the critical dimension sigma on femto with target 0.5um sigma for FH improvement.
- Implement new lamination method and new cleaning technique.
March 1995- September 2003 : Western Digital ( Thailand ) Ltd. ( USA )
Senior Process engineer of Etching/DLC/Photo section of the slider fabrication.
1. Serialization process : To create the slider serialize number on the back side of the wafer
- Sustain the process yield, productivity, 1% yield improved within 1 quarter, 4% defect reduction within 2 quarters.
- Develop new recipe to simplify process in term of the modify the tooling and equipment, new mask create method implementation.
2. Metalization process : To coating gold on the back side of the slider for Maxtor product, reduce the resistance on the 80GB
- Sustain the process yield, productivity
- Develop new recipe to simplify process in term of the modify the tooling and equipment
3. Contamination control engineer, Contamination section ( Reliability )
- Contamination development and improvement to perform over product, machine, process and overall customer failure analysis requirement
- Internal failure analysis to identify root cause from contamination.
- 5S core team for Slider fabrication, HGA and HSA
- Internal data control, temperature, humidity, particle control system
- Implement new glove bin for clean room
- Implement bunny suit control system
- Implement new design of curtain under the laminar
- Photolithography process engineer
- 2 step etch photolithography process, sustaining and development, 98% yield improved achievement, new project transfer.
- Undershoot photolithography process transfer
March 1994- 1995: Lite-On Industrial(Thailand)Ltd. ( TAIWANESE )
Photolithography process engineer ; dry film, wet film and component mark process
- Sustain the process yield, productivity
- Develop new recipe to simplify process in term of the modify the tooling and equipment
March 1991- 1994: P.C.B Center(Thailand) Co.Ltd. ( HONG KONG )
Photolithography Production Superintendent ; dry film, wet film and component mark process
- Sustain the process yield, productivity
- Develop new recipe to simplify process in term of the modify the tooling and equipment
Oversea Training ( USA/China/Singapore/Phillipine/Hongkong ):
The SPIE short course for
- “ Plasma Processing “ on March 1996, California USA.
- “ Resist Thickness Bake, Exposure and Development control “ on March 1996, California USA.
- “ Introduction to Micro-Lithography :Theory, Material and Processing “on March 1996, California USA.
- “ Introduction to MEMs “ on November 2000, Singapore
- “ Extending Semiconductor Lithography Resolution Using Image Process Integration “ on November, Singapore
Ultratech Stepper training “ 1500/1700 Maintenance course “ on 2-13 December 1996, California USA
Process transfer from California, USA
- “ Full Pallet Debond project “ on February, 1995
- “ New Full Pallet Debond Improvement “ on June-July 1995
- “ Undershoot product “ on September-October 1995
- “ Proximity pad project “ on 1996
- “ High density Pico process transfer “ on 1996
Technical Seminar for Slider Technology Process Solutions by Veeco at Dong Guan city, Goung Dong, PRC on 16 May’05
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